ps7801c-1a nec's 4-pin ultra small flat-lead super low output capacitance 1-ch optical coupled mos fet california eastern laboratories ? ultra small flat-lead package : 4.2 (l) 2.5 (w) 1.85 (h) mm ? super low output capacitance : c out = 0.5 pf typ. ? low c r : c r = 6.5 pf ? ? 1 channel type: 1 a output ? design for ac/dc switching line changer ? low offset voltage ? ordering number of taping product: ps7801c-1a-f3, f4: 3 500 pcs/reel features preliminary data sheet nec's ps7801c-1a is a low output capacitance solid state relay containing a gaas led on the light emit - ting side (input side) and mos fets on the output side. an ultra small ?at-lead package has been provided which realizes a reduction in mounting area of about 50% compared with the ps72xx series. it is suitable for high-frequency signal control, due to its low c r, super low output capacitance, and low off-state leakage current. description ? measurement equipment application
ps7801c-1a package dimensions (unit: mm) marking example 3.6 +0. 3 -0.4 2.50.3 4 3 1 2 n 4.20.2 0.2 max. 0.20.1 3.0 max. 1.27 1.850.05 0.40.1 1. led anode 2. led cathode 3. mos fet 4. mos fet 4 3 1 2 top view 0.15 +0. 1 -0.0 5 0.20.1 0.36 4.60.2 503 5 n 03 assembly lot w eek assembled ye ar assembled no.1 pin mark (knicked corner) an initial of "nec" (marking details) last number of type no. : 1c *1 *2 *1 the marking corresponds to the last two digits of the part number belo w. ps7801c-1a *2 bar : pb-free 1c
ps7801c-1a ordering information absolute maximum ratings ( t a = 25oc, unless otherwise speci?ed ) part number order number solder plating specification packing style ps7801c-1a-f3 ps7801c-1a-f3-a pb-free embossed tape 3 500 pcs/reel PS7801C-1A-F4 PS7801C-1A-F4-a parameter symbol ratings unit diode forward current (dc) i f 50 ma reverse voltage v r 5.0 v power dissipation p d 50 mw peak forward current *1 i fp 1 a mos fet break down voltage v l 30 v continuous load current i l 80 ma pulse load current *2 (ac/dc connection) i lp 160 ma power dissipation p d 250 mw isolation voltage *3 bv 500 vr.m.s. total power dissipation p t 300 mw operating ambient temperature t a ? 40 to +85 c storage temperature t stg ? 40 to +100 c *1 pw = 100 s, duty cycle = 1% *2 pw = 100 ms, 1 shot *3 ac voltage for 1 minute at t a = 25 c, rh = 60% between input and output. pins 1-2 shorted together, 3-4 shorted together. recommended operating conditions ( t a = 25oc ) parameter symbol min. typ. max. unit led operating current i f 2 5 20 ma led off voltage v f 0 0.5 v
ps7801c-1a electrical characteristics ( t a = 2 5 85 oc ) parameter symbol conditions min. typ. max. unit diode forward voltage v f i f = 5 ma 1.1 1.4 v reverse current i r v r = 5 v 5.0 a mos fet off-state leakage current i loff v d = 30 v 0.1 1.0 na output capacitance c out v d = 0 v, f = 1 mhz 0.5 0.7 pf coupled led on-state current i fon i l = 80 ma 2.0 ma on-state resistance r on i f = 5 ma, i l = 80 ma 13 17 turn-on time *1, 2 t on i f = 5 ma, v o = 5 v, r l = 500 , pw 10 ms 0.03 0.5 ms turn-off time *1, 2 t off 0.1 0.5 isolation resistance r i-o v i-o = 0.5 kv dc 10 9 isolation capacitance c i-o v = 0 v, f = 1 mhz 0.3 pf *1 test circuit for switching time *2 the turn-on time and turn-off time are speci?ed as input-pulse width 10 ms. be aware that when the device operates with an input-pulse width less than 10 ms, the turn-on time and turn-of f time will increase. pulse input input monitor monitor v o v l r l i f r in t on t of f 10% 90% input 0 output v o = 5 v 50%
ps7801c-1a life support applications these nec products are not intended for use in life support devices, appliances, or systems where the malfunction of these prod ucts can reasonably be expected to result in personal injury . the customers of cel using or selling these products for use in such applications do so at their own risk and agree to fully indemnify cel for all damages resulting from such improper use or sale. a business partner of nec compound semiconductor devices, ltd. 04/1 1 /2005 notes on handling recommended soldering conditions (1) infrared re?ow soldering ? peak re?ow temperature 260 c or below (package surface temperature) ? time of peak re?ow temperature 10 seconds or less ? time of temperature higher than 220 c 60 seconds or less ? time to preheat temperature from 120 to 180 c 120 30 s ? number of re?ows three ? flux rosin ?ux containing small amount of chlorine (the ?ux with a maximum chlorine content of 0.2 wt% is recommended.) (2) wave soldering ? temperature 260 c or below (molten solder temperature) ? time 10 seconds or less ? preheating conditions 120 c or below (package surface temperature) ? number of times one ? flux rosin ?ux containing small amount of chlorine (the ?ux with a maximum chlorine content of 0.2 wt% is recommended.) (3) cautions ? fluxes avoid removing the residual ?ux with freon-based and chlorine-based cleaning solvent. 220oc package surface t emperature t (oc) t ime (s) (heating) to 10 s to 60 s 260oc max. recommended temperature profile of infrared reflow 12030 s (preheating) 180oc 120oc
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